Novel Low-Temperature Direct Joining Type Cu-Alloy Pastes for Silicon Solar Cells

• Main Authors: Te-Hsien Cheng, 鄭得賢
• Other Authors: Lung-Chuan Tsao
• Format: Others
• Language: zh-TW
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/59950252710328484964

碩士 === 國立屏東科技大學 === 材料工程研究所 === 101 === This study is divded into two parts：(1)Use four kinds of low temperatrue SB system(SB1C,SB4T,SB4TC and SB1TA) active solders is bonding with Cu substrate and Si chip, and then analysis of microstructure,mechanical properties and fracture surface.(2)The SB pastes is prinited and fabrication electrode form to the silicon solar cells, and then analysis of microstructure and electrical properties. The novel SB system pastes was found particles size about 100nm. The 2θ angle(20-50°) is appeared nano patterns diffraction peak by XRD analyzed, which through reflow is turned into crystal diffraction peak. Another, four kind of alloy solders, Cu powder and other solvents preparation to the novel composite active soder/Cu pastes. After at 180℃, the resistivity of the SB composite active/Cu electrode is similar Ag electrode(7E-06 Ω‧cm).