| Summary: | 碩士 === 國立高雄第一科技大學 === 系統資訊與控制研究所 === 101 === In order to miniaturize sophisticated electrical component, the ball grid array (BGA) of semiconductor packing method is needed. However, the temperature control is important major process of BGA processes. The purpose of this thesis is to keep uniform temperature between a stove and well mixed of tin liquid on BGA process, and then to improve the yield rate, a curve of temperature even to reduce consumption of electric power. Hence, the phase changed between liquid and gas approach with PID, Fuzzy, Fuzzy-PID control logic to homogenize uniform temperature. Finally, the iterative training Fuzzy-PID approach is used to obtain the best parameters of Kp, Ki, Kd. The experimental results of this thesis show that：When gas pressure is 50psi, gas type is nitrogen, the liquid height is two-thirds in tin stove, the liquid temperature of tin stove can keep on 300℃/12.22min and the range of variation is ±2℃ on stove plate with iterative training Fuzzy-PID approach.
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