The Conductive Interconnection Quality of a Metal-Coated-Microsphere Assembly

• Main Author: 曾彥霖
• Other Authors: 王可文
• Format: Others
• Language: zh-TW
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/59813385135966117585

碩士 === 國立彰化師範大學 === 機電工程學系 === 101 === Conductive metal-coated-microspheres have been widely used in anisotropic conductive film (ACF) for conductive electrical connections. This paper discusses the conductive interconnection quality of a metal-coated-microsphere assembly. To enhance the mechanical strength, the assembly was sealed by underfill and successfully tested under various temperatures (25oC~150oC) and strength conditions (compressive stress 0kN/m2~910kN/m2, shear stress 0kN/m2~55kN/m2). Unlike traditional soldering or ACF applying processes, these electrical connections are not built by chemical bonding or phase transition. There are only physical contacts between electric pads and micro-conductive beads. The interconnect resistance will be evaluated under the influence of applying stresses and working temperatures. Testing results and a modified mathematic model are presented in this thesis to evaluate the interconnection quality, the proposed assumptions and mechanisms.