| Summary: | 碩士 === 國立中央大學 === 光電科學與工程學系 === 101 === In this investigation, an on-chip 20-Gbps optical interconnect module is realized on polymer waveguides terminated with 45° micro-reflectors as vertical couplers. The proposed module including vertical-cavity surface-emitting laser (VCSEL), Photodetector (PD), driver IC, and amplifier IC is constructed on single silicon substrate. It’s first time to demonstrate a 20-Gbps per channel in on-chip optical interconnect.
The driver and amplifier IC are employed to control the VCSEL and PD, respectively. In the transmitting part, the lightwave emitting from VCSEL impinge upon 45° micro-reflectors, and couple into polymer waveguide. In the receiving part, the lightwave propagating in the polymer waveguide is bent by 45° micro-reflectors and emitted into PD. Due to adopt the polymer waveguides terminated with 45° micro-reflectors, the lightwave could be formed three-dimensional optical, and connect the optical signal between transmitting and receiving parts.
The proposed optical interconnect provide the benefit of high optical coupling efficiency and simply fabrication process. Due to tune the geometric core size of polymer waveguide, the optical mode between active photoelectric components and polymer waveguide could be matched to enhance the optical coupling efficiency. The high precision flip-chip technique could be employed to assemble the VCSEL and PD on proposed module, the assembling alignment tolerance could be controlled within ±5 um. The optical coupling efficiency between VCSEL and PD is measured as 34%
In the high–speed signal measurement, the 20-Gbps error-free transmission with pseudo-random binary sequence (PRBS) of 27-1 is demonstrated. In this module, the driving and modulation current is set as 8.3 and ±4.69 mA, respectively, and the reverse bias of PD is about 1.7 V. In the eye diagram measurement, the jitter of 17.681 ps and eye height of 13 mV are measured. The signal-to-noise ratio is measured as 7.56. The bit error rate could be pass the 10-12, it’s prove that the proposed module can be used in transmission of data-rate of 20-Gbps.
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