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碩士 === 國立中央大學 === 化學工程與材料工程學系 === 101 === In this study, two flip-chip joint structures, (1)Cu/Sn3.5wt%Ag/Cu and (2)Cu/Sn/Cu were stressed with a high current density of 104 A/cm2 at 50~ 150℃for 0~200 hours. Electromigration induced Cu consumption was observed in the cathode Cu bond-pads of both cur...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/56574539478422662486 |