Etch Process Improvement for Passivation Layer of Semiconductor Devices to Reduce the Polymer Residues
碩士 === 國立交通大學 === 工學院半導體材料與製程設備學程 === 101 === The passivation layers of microchips inhibit the attacks from chemicals, moisture and contaminants to ensure reliable operation of electronic products. Silicon nitride (Si3N4) is the most common passivation material. This thesis studies the suppression o...
Main Authors: | Chang, Si-Fu, 張時輔 |
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Other Authors: | Hsieh, Tsung-Eong |
Format: | Others |
Language: | zh-TW |
Published: |
2012
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Online Access: | http://ndltd.ncl.edu.tw/handle/81965163217142436495 |
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