Balancing Mask Density on Triple Patterning Lithography Aware Gridless Detailed Routing
碩士 === 國立交通大學 === 資訊科學與工程研究所 === 101 === For the sub-14nm technology node, triple patterning lithography (TPL) is adopted, which decomposes a single layer into three masks to increase pitch and enhance the resolution. In routing stage, considering TPL can improve the flexibility of layout decomposit...
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| Format: | Others |
| Language: | en_US |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/64569855320346299132 |
| Summary: | 碩士 === 國立交通大學 === 資訊科學與工程研究所 === 101 === For the sub-14nm technology node, triple patterning lithography (TPL) is adopted, which decomposes a single layer into three masks to increase pitch and enhance the resolution. In routing stage, considering TPL can improve the flexibility of layout decomposition. Moreover, layouts with balanced density can reduce edge placement error(EPE)[2]. This work considers the mask density balancing based on triple-patterning lithography aware detailed router[6] to improve the printability. Swapping pseudo colors and density aware stitch generation are proposed to balance mask density. The result shows that there is the trade-off between stitch counts and additionally considering the local density constraint besides the global density constraint.
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