Enhancement of 5S Management in Semiconductor Manufacturing

• Main Authors: Chen, Chuan-Yung, 陳權勇
• Other Authors: Chang, Yung-Chia
• Format: Others
• Language: en_US
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/39085310939389997861

博士 === 國立交通大學 === 工業工程與管理系所 === 101 === Scene management of a semiconductor wafer fabrication (fab) was identified as a complex problem. When building a state-of-the-art wafer fab, it was common to find thousands of action items to complete in order to comply with customer (auditor) expectations toward scene management sustained by 5S method. However, the scope of traditional 5S method was too general to cover scene management. This research proposed a framework of CLEAN to deal with scene management. This CLEAN framework, not exclusive to the 5S method, listed 14 critical check points according to fab’s distinct characteristics and intensive literature review. Then, the CLEAN framework applied Ho’s 5S checklist by Kano model to classify quality attributes for 47 5S check points of 5S checklist and to reveal significant 5S check points that customer valued the most with respect to customer voice. Finally, the problem of resource constraints was one of the biggest challenges facing an auditor prior to a new fab released for production when audit preparation was a subject for the 5S readiness of a fab. There was a finite amount of resource for the auditee (fab) while customer was trying to understand the fab’s approach and to ensure that the 5S requirements are compliant. A new method was proposed to apply Failure Modes and Effects Analysis (FMEA) associated with Risk Priority Number (RPN) for quantifing and prioritizng 5S activities of scene management. This method of 5S-FMEA and 5S-RPN was applied to a real wafer fab to demonstrate a convincing result. Hence, a fab manager could sustain scene management for a fab and thereafter ensure order confirmation from customer through the adoption of this proposed CLEAN framework.