Phase stabilities of Pb-Sn and Bi-Ni alloys under current stressing: An ab initio-aided CALPHAD study
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 101 === The effects of electric currents on metallic materials, such as the Joule heating and electromigration, crucially affect the reliability of electronic products. With the developments of the advanced packaging methods, e.g. the 3D IC and flip-chip packaging...
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| Format: | Others |
| Language: | en_US |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/76531762825255042092 |