The Effects of Applied Strains on the Ag/Sn Interfacial Reactions
碩士 === 國立中興大學 === 化學工程學系所 === 101 === Damages on material are unavoidable in the production process and application of electronic device. One of these damages is mechanical strain which is resulted from the difference between the coefficients of thermal expansion (CTE) of materials. It may affect...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/e6garw |