Technology Roadmaps of Chipset Vendors-A Comparison of Five Companies
碩士 === 國立政治大學 === 企業管理研究所 === 101 === Recently global smartphone market has experienced high growth rates. Many manufacturers, components as well as finished product assemblers, are competing in the markets. The most competitive markets are processor chipsets and baseband chipsets. In recent yea...
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ndltd-TW-101NCCU51211272015-10-13T22:29:55Z http://ndltd.ncl.edu.tw/handle/44165089766351756917 Technology Roadmaps of Chipset Vendors-A Comparison of Five Companies 手機晶片業者技術佈局之研究 Yeh, Chih Ting 葉治廷 碩士 國立政治大學 企業管理研究所 101 Recently global smartphone market has experienced high growth rates. Many manufacturers, components as well as finished product assemblers, are competing in the markets. The most competitive markets are processor chipsets and baseband chipsets. In recent years, the competitive positions of major vendors have been rapidly changed. We observed that only few vendors can always be successful in this field. Most leadering companies came from other areas, like PC industries and multimedia chipsets. This research investigates how firms have developed their strategies in light of their backgrounds, market positions, and resources when demands and technology developments are rapidly changed. This research is particularly interested in how leadering companies strengthen their competitive abilities and, when firms penetrate into in a new market, how they can survive in the new market and even become maket leaders. In this thesis, the researcher uses three factors (i.e., market changes, technology developments and major firms’strategys) to analyze mobile chipsets industry. The results show that market leaders can maintain competitive advantage by leveraging patents as entry barriers, legating to put pressure on competitors, taking aggressive pricing strategies to attack new entries, developing firm-specific assets and creating values to clients by new product and services. In addition, the research finds that firms can successfully build their competitive positions in new markets by finding customers who had be ignored, innovating service processes, selecting effective customers, selecting the timing to enter the market, extending core competence and engaging in strategic acquisitions. 于卓民 學位論文 ; thesis 105 zh-TW |
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碩士 === 國立政治大學 === 企業管理研究所 === 101 === Recently global smartphone market has experienced high growth rates. Many manufacturers, components as well as finished product assemblers, are competing in the markets. The most competitive markets are processor chipsets and baseband chipsets. In recent years, the competitive positions of major vendors have been rapidly changed. We observed that only few vendors can always be successful in this field. Most leadering companies came from other areas, like PC industries and multimedia chipsets. This research investigates how firms have developed their strategies in light of their backgrounds, market positions, and resources when demands and technology developments are rapidly changed. This research is particularly interested in how leadering companies strengthen their competitive abilities and, when firms penetrate into in a new market, how they can survive in the new market and even become maket leaders.
In this thesis, the researcher uses three factors (i.e., market changes, technology developments and major firms’strategys) to analyze mobile chipsets industry. The results show that market leaders can maintain competitive advantage by leveraging patents as entry barriers, legating to put pressure on competitors, taking aggressive pricing strategies to attack new entries, developing firm-specific assets and creating values to clients by new product and services. In addition, the research finds that firms can successfully build their competitive positions in new markets by finding customers who had be ignored, innovating service processes, selecting effective customers, selecting the timing to enter the market, extending core competence and engaging in strategic acquisitions.
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于卓民 |
author_facet |
于卓民 Yeh, Chih Ting 葉治廷 |
author |
Yeh, Chih Ting 葉治廷 |
spellingShingle |
Yeh, Chih Ting 葉治廷 Technology Roadmaps of Chipset Vendors-A Comparison of Five Companies |
author_sort |
Yeh, Chih Ting |
title |
Technology Roadmaps of Chipset Vendors-A Comparison of Five Companies |
title_short |
Technology Roadmaps of Chipset Vendors-A Comparison of Five Companies |
title_full |
Technology Roadmaps of Chipset Vendors-A Comparison of Five Companies |
title_fullStr |
Technology Roadmaps of Chipset Vendors-A Comparison of Five Companies |
title_full_unstemmed |
Technology Roadmaps of Chipset Vendors-A Comparison of Five Companies |
title_sort |
technology roadmaps of chipset vendors-a comparison of five companies |
url |
http://ndltd.ncl.edu.tw/handle/44165089766351756917 |
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