| Summary: | 碩士 === 明新科技大學 === 精密機電工程研究所 === 101 === In view of the importance of the LED illumination industry, this research was to cooperate with Paragon Semiconductor Lighting Technology Co., Ltd. to analyze their manufacture process of the MCP (multi-chip package) LED. The research studied the original process in the company, and found that the company spent too much man power for the inspection process. The efficiency is very low, and the defectiveness of the production is too high. There were several functions purposed in this research:
1. To build the loading and unloading devices that are compatible to the front and rear equipments;
2. To build an automatic transmitting system for the products;
3. To build an on-line automatic optical inspection system for the MCP LED;
4. To extract the defective products automatically, and record the fault positions;
5. To build a PC based computer control.
The research has developed an automatic on-line inspection system for the MCP LED, which is able to reduce labor requirement and prduction defectiveness for the company.
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