Studies on the Nanoindentation Technique for Measuring the Mechanical Properties of the Metal Films at Elevated Temperatures

• Main Authors: Wu, Chin-Hsing, 吳進興
• Other Authors: Ting, Kuen
• Format: Others
• Language: zh-TW
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/27263828037607036405

碩士 === 龍華科技大學 === 工程技術研究所 === 101 === In this study, the effects of changing temperature on mechanical properties of nano metal structure were studied by using nanoindenters and thermal stage. Firstly, the impact of using basic materials in the production of semiconductor water was not considered in substrate. In the elevated temperature, the Young’s modulus and hardness of the substrate reduced. The Young modulus decreases along with the increase of the indentation load force and decrease of the indentation depth. With the large number of application to semiconductor, MEMS film and film technology, aluminum has been a chip inside the wire material, this study is to support wafer thin aluminum substrate. Nanoindenter was used to measure film’s hardness and Young’s modulus to understand the aluminum metal film mechanical properties at elevated temperatures.