Optimization Parameters for Second Bond at Zero Time Using a Ball Grid Array through Taguchi Experiments
碩士 === 國立高雄應用科技大學 === 電子工程系 === 101 === In recent years, the rapid expansion of the IC and semiconductor industries has forced manufacturers to reduce R&D cycles, product sizes and product life cycles, while improving production efficiency of production. In semiconductor packaging, given the sam...
Main Authors: | Feng-Sheng Lee, 李豐昇 |
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Other Authors: | Cheng-Hong Yang |
Format: | Others |
Language: | zh-TW |
Published: |
101
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Online Access: | http://ndltd.ncl.edu.tw/handle/30095821822708572640 |
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