A Study on the Effect of Chip Quality of Cutting Parameters for Thin Wafer
碩士 === 國立高雄應用科技大學 === 電子工程系碩士班 === 101 === Abstract Purpose: DRAM stacked package process wafer thinning cutting many problems. Thus, solving the cutting that causes the problem is the most important aim of this study , onboard test and reliability test in the study the experience testing side b in...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/20538819552726835113 |