The Optimal Applying Parameters for Ceramic Substrate Scribing in the Passive Component Industries Using UV Laser - A Case Study of Chip Resistor

• Main Authors: Hsuan-Wei Wu, 吳璿緯
• Other Authors: Tien-Tsorng Shih
• Format: Others
• Language: zh-TW
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/11328269278870975233

碩士 === 國立高雄應用科技大學 === 電子與資訊工程研究所碩士班 === 101 === Science and technology are fast developing nowadays. The consuming portable electronic communication and information products are almost advanced quarterly. The development of light, thin, short, small and multi-functional 3C electronic products - Smart mobile phone , are growing up fastestly at present. Active and passive components used in 3C products are increasing gradually by times and become more miniature. The miniaturization evolution of 3C products is the motive power and new opportunity to the industry of passive components. Of course R&D technology, quality and productivity are the key points that every company pursues. To meet the demand of consumer market, the products become complex and changeable because of the technical upraise through R&D process. R&D speed as well as productivity utilization will decide whether the enterprise makes the profit or not. This study uses Taguchi experiment analysis to get the parameter characteristics of electronic ceramic substrates during UV laser scribing process. And understand the most important thing to get the best quality such as scribing line width and depth is matching laser parameter. In cutting and scribing process, properly adjustment of the parameters like laser power, frequency, cutting speed, step, pulse and so on can get narrower cutting line and better depth. If it needs to change the cutting depth and line width, just need to refer to the importance sequencing of each factor and make the adjustment according to the actual situation. Therefore, hope this study can provide a reference for UV laser application to the related industries and is helpful to improve the productivity and yield of passive components.