Key Success Factors of the Semiconductor Packaging and Testing Industry

• Main Authors: Hung,Minglang, 洪銘朗
• Other Authors: Teng,Junnyuan
• Format: Others
• Language: zh-TW
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/72020887531390188893

碩士 === 華梵大學 === 工業工程與經營資訊學系碩士班 === 101 === After more than twenty years developing, the Semicondutor Packaging & Testing industry in Taiwan becomes the wolrdwide No.1 and one of the main industries of Taiwan. However, at the same time, the competitives from China and industry merge and acquisition make the enterprises of this industry to consider how to compete in the future. The issue is getting more significant and critical issue. Hence, this study aims to collect Key Success Factors (KSFs) of competences for this industry through literature review and design of a questionnaire survey. This comprises five major aspects base on Five Forces Analysis Model. Under the structure, we proceed with categorization and analysis by using Analytic Network Process (ANP), which was applied to this study to explore the KSFs. The ordered ranking of the five aspects is: “the bargaining power of consumers”, “competitive rivalry within an industry”, “the bargaining power of suppliers”, “threat of new entrants”, and “threat of substitute products”. The results sifted from the ANP approach suggest six top KSFs: “Quantity of Orders”, “Service Model”, “Degree of Cooperation”, “Differentiation of Products”, “Degree of Supporting”, and “Capability of Quality Control”. In future, enterprises in this industry should concern customer-side factors more.