| Summary: | 碩士 === 逢甲大學 === 產業研發碩士班 === 101 === In recent years, extensive use electronic communication products has been prevalent for pursuing of a more comfortable and convenient living environment. The outcome is the problem of electromagnetic interferences between electronic components and this has rendered the issue of electromagnetic compatibility (EMC) to be of prime importance. However, with the integrated circuit (IC) operating at an ever faster speed, the problem of electromagnetic interference will become more serious. IC has become an important source of electromagnetic interference in the entire electronic system. With the advances in process technology, the cost and difficulty in developing an IC can be challengingly high. In general, we need to address the Integrated Circuit Electromagnetic Compatibility (IC-EMC) related issues at the designing stage.
In this study, laboratory measurements of uncertainty evaluation were first performed in accordance to the international standard IEC 61967-2[2] specification to ensure the accuracy of the measured data. Subsequently, different bonding on IC was utilized to improve the overall electromagnetic interference (EMI). Finally, these results were implemented in electronic design automation (EDA) software for simulation and analysis to establish the initial electromagnetic behavioral model for the IC.
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