The Constituents Analysis and Stability Study of Stability Agents and Complexing Agent of Electroless Copper Plating Solution
碩士 === 朝陽科技大學 === 應用化學系碩士班 === 101 === Electroless plating is often used in industry as a plating method. In the electroless copper plating solution, copper will fast and homogeneously deposit on the surface of the substrate. This is an effective method for non-metallic surface metallization; moreov...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/73090396385159536351 |