The Constituents Analysis and Stability Study of Stability Agents and Complexing Agent of Electroless Copper Plating Solution

• Main Authors: Fei-Fan Ye, 葉非凡
• Other Authors: Chang-Nam Chen
• Format: Others
• Language: zh-TW
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/73090396385159536351

碩士 === 朝陽科技大學 === 應用化學系碩士班 === 101 === Electroless plating is often used in industry as a plating method. In the electroless copper plating solution, copper will fast and homogeneously deposit on the surface of the substrate. This is an effective method for non-metallic surface metallization; moreover, it doesn’t need to work under high temperature and vacuum environment. Above advantages make the solution formulations of electroless plating become one of the interesting research points. The additives used in electroless plating solution are usually few milligrams to tenth milligrams per liter, however, they always play important roles for the stability of solution or improving the function of the coating layer on substrate surface. In this paper, the identification and quantitative measurement of the stabilizer reagent and a complexing agent of an industry used electroless copper plating solution are studied by using electrospray ionization mass spectrometer (ESI-MS), NMR spectrometer, UV-VIS spectrophotometer and other common analytical instruments. The stabilizer is confirmed as sodium thiocyanate(NaSCN) with a concentration of 1800 ppm. Another complexing agent is identified as 2,2-bipyridine with a concentration of 180 ppm. Finally, these two components are applied in the electroless plating tests and give a better performance on both stability and coating properties on copper-nickel deposit substrate than the results obtained by original electroless plating formulation.