| Summary: | 碩士 === 中原大學 === 機械工程研究所 === 101 === The research presented in this thesis studied basic heat exchange of microchannels, and discussed thermal experiments and numerical analyses by using microchannel heat exchangers attached to a 20W high-power LED module. This LED module was set on the microchannel heat exchanger module as a basic experimemtal to obtain the surfaces of the LED chip, the external temperature of microchannels.
In this study, under constant surface heat transfer condition, the distributions of velocity and temperature fields inside the microchannel were simulated and analyzed. The software of ESI-CFD-ACE+ was used for numerical simulations. The errors between the results obtained from the experiments and those obtained from the simulations were in the range of 0.4%-7.4%, with an average error of 3.98%. The silicon wafers used in the experiments were fabricated by semiconductor manufacturing process, and the working fluid was de-ionized water, with the Reynolds number ranging from 94 to 1260. The experimental results showed that for different microchannel heat exchangers, the curves of LED chip temperature versus the Reynolds number of the flow were reasonable. The resulting temperature distributions were more uniform within the microchannel, and as a result, dissipated more heat from the LED chip.
The input power was 20 W, and by using the microchannel heat exchangers, the LED chip surface temperature has dropped significantly. The LED chip temperature dropped from 85 ℃ by using the single fin-type heat sink to 47 ℃ by using the microchannel heat sink. Thus using the microchannel heat sink has shown to be effective in help solving the heat concentration problems associated with the LED chips.
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