Applying DFM&A theory improvement on manufacturing and quality of the electronic products

• Main Authors: Ya-Jing Chiou, 邱雅靖
• Other Authors: Kang-Hung Yang
• Format: Others
• Language: zh-TW
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/18292111297233971253

碩士 === 中原大學 === 工業與系統工程研究所 === 101 === Because the concept design phase in the product initializing stage is usually the key for defining the cost and the quality of the product, to reduce non-performing rate of PCBA manufacturing process, from the early design concept of DFMA is integrated into the product design. According to the manufacturing assembly design requirements to improve unnecessary wastes in the design, the ability to enhance the production only helps achieving the product functional requirements, but also assists reducing design and production cost. Products designed to meet the exact process and assembly, to achieve the overall goal of concurrent engineering. According to Dr. Taguchi's quality engineering, most companies will focus on the core design of the system design, while neglecting the importance of design parameters. This research for both product design and system process design explores how to improve manufacturing processes and design approach electronics assembly with a case study. A series of practical experiments on conducting the product design and wave solder processes helps to improve the solderability and other related issues. The experimental results show that PCB design changes can amend potential defects in the product design stage and, reduce product redesign changes or rework time. In the process improvement phase, an inclusion of flux spray results in 42% of cost saving; adverse nitrogen equipment comparing to the original usage has 37% in reduction; dross is reduced by 38%; dross clean time reduces 45 minutes comparing to the original process. All of the evidences show that the new solution improves the efficiency and prevents the poor quality problem from reoccurrence.