| Summary: | 碩士 === 中原大學 === 工業與系統工程研究所 === 101 === This study aims to probe the characteristics of solder mask in printed circuit board manufacturing, and also by using the lean six sigma (DMAIC) structure approach to develop the processes (Define, Measure, Analyze, Improve, and Control) to perform solder mask quality control plan. The developed process will be provided to enable the field operator as procedure in order encountered quality issue can be recovered and resulted swiftly, and by it to reduce problem solving time and improve the production efficiency.
This quality control plan can be built by departments based on their main flow, and by those accumulated experience in resulting issues to form the preventive actions and finalize those actions to be the field operation standard procedure to improve the company capability in sealing quality issues.
In this study, suggestion related to eliminate eight wastes in printed circuit board manufacturing will be also provided as reference based on the lean manufacturing approach.
|
|---|
