The Study of Thermal Behavior of Board Level with Copper Pillar to POP Package
碩士 === 中華大學 === 機械工程學系碩士班 === 101 === ABSTRACT The trend of electronic products today is moving toward further miniaturization, high functionality and improved performance. To accomplish this, new packaging needs to be able to integrate more dies with greater function, higher I/O counts, smaller pit...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/kt9623 |