The Reliability Tests of Heat and Moisture and the Damage Analyses on Through Silicon Via Structure
碩士 === 國防大學理工學院 === 車輛及運輸工程碩士班 === 101 === Because of the limiting vehicle space, electronic components must be thin, small, multi-functional, and operable in harsh environments. To promote the electronic products, 3D stack packaging technology, especial the Through Silicon Via (TSV) technology, bec...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/16013092738670319096 |