The Reliability Tests of Heat and Moisture and the Damage Analyses on Through Silicon Via Structure

• Main Authors: Lin, Ming-Hsien, 林明賢
• Other Authors: Kuang-Hsu,Hou
• Format: Others
• Language: zh-TW
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/16013092738670319096

碩士 === 國防大學理工學院 === 車輛及運輸工程碩士班 === 101 === Because of the limiting vehicle space, electronic components must be thin, small, multi-functional, and operable in harsh environments. To promote the electronic products, 3D stack packaging technology, especial the Through Silicon Via (TSV) technology, becomes the best solution. To this end, the reliability of TSV products becomes more and more important at the same time. To analyze the TSV reliability issues for vehicles, thermal aging and cyclic temperature humidity behaviors for a typical TSV under current/voltage bias effects, are systematically studied in this thesis. Parameters for the reliability model are next extracted so that the reliability model is built, and failure analyses are followed by SEM inspection. The results of this study may provide useful references to the vehicle industries for the reliability analysis on automotive semiconductors.