Comparison among Various Thermal and Vibration Loadings as well as the Combined Test for Flip Chip Ball Grid Array Components
碩士 === 元智大學 === 機械工程學系 === 100 === Abstract The electronic devices such as those used in automotive or avionic industries, all subjected to vibration and thermal environmental loadings. These electronics were tested for their reliabilities with thermal and vibration test conducted separately in the...
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/29635936501667423762 |