The Optimum Method to Detect HDI PCB Fill Via Crack Problem - Design of Experiment
碩士 === 元智大學 === 工業工程與管理學系 === 100 === The consumer product trend achieve thin and small, but more func-tion requirement. PCB manufactures have to use ELIC(Every Layer In-terconnection) technology to satisfy customer needs. That means each via connected reliability in ELIC structure is all important....
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/24105391558791101766 |