Development of Environmental Conscious Adhesive Dispensing Process and Innovative Parametric Design

• Main Authors: Cheng-Fu Peng, 彭晟輔
• Other Authors: Chien-Yi Huang
• Format: Others
• Language: zh-TW
• Published: 2012
• Online Access: http://ndltd.ncl.edu.tw/handle/wjrrua

碩士 === 國立臺北科技大學 === 工業工程與管理系碩士班 === 100 === In recent years, the microelectronic manufacturing grows rapidly. Process optimization to production yield is major focus of the industry. To meet the requirement in product miniaturization and multi-function, surface mount technology (SMT) and through-hole technology (THT) are used to assembly the double sided printed circuit board (PCB). In through-hole technology, the soldering carrier is commonly used to cover the component assembled on the first side. This is to avoid the component from being contact with the molten solder and fall off. However, using the carrier will increase the production costs. This study aims at a sound card and investigates the adhesive dispensing process to replace the necessity of carrier. The CEM-1 PCB material and the 0805 passive components are under consideration. The lead-free solder 58Bi/42Sn with low melting point is used in this research. This study consider the shear strength of components from both the horizontal and vertical directions at normal and high temperature. This is to simulate the effects of molten solder acting on the passive components. Thus, this study involves multi-quality characteristics. We used Taguchi method to investigate the effect of dispensing position, pressing time, curing temperature and the conveyor speed. The principal component analysis (PCA), principal component gray relational analysis and innovative artificial neural network are exercised to handle the multiple quality characteristics and determine the optimal process parameters. The result showed that the parameter determined by innovative artificial neural network parameters design is better than the others. The optimal process is implemented in the production line to verify its effectiveness.