| Summary: | 碩士 === 聖約翰科技大學 === 自動化及機電整合研究所 === 100 === This article is mainly concentrating on Parylene chemical vapor deposition , surface improvement and treatment of substrate as well as analysis of film on Glass、PMMA、Aluminum and its surface adhesion by dipping under A-174 silane solution and conducting on plasma treatment(18 W). Those results can be further analyzed by parylene, which has the characteristic of organic thin film and mechanical properties.
Experiments focusing on adhesion of surface treatment of substrate have shown that 600 nm thick glass of deposition on parylene C thin film is able to carry out the maximum capacity raised from 14.1 mN to 18.5 mN. As a result, thin film adhesion can be greatly improved by surface treatment. Secondly, to package flexible organic light-emitting diode components, using PET substrate to manufacture package-chip to experimentally estimate its water vapor transmission rate. To compare the results of surface treatment by using A-174 silane solution and Plasma treatment (18 W) with original one, the water vapor transmission rate result has shown that PET dipping within A-174 silane solution with 600 nm depositing package-chip has better insulation result, which obtaining 3.02 g/m2 × day. To the application of package components, package-chip and Parylene thin film have essentially effect on insulation, but the result has not come out as we anticipate ideally. The possible reason to explain it would be there is an limitation on the characteristic of monomer performance for organic material. To enhance its quality and characteristic, organic material should be combined with other material such as most prevalent used of ABS material, which has characteristic of collision-resistant, good thermal stability and easy processing characteristics. as well as combination of multiple polymer.
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