| Summary: | 碩士 === 中國文化大學 === 機械工程學系數位機電碩士班 === 100 === As the connector industry in transition into the field of automotive electronics and industrial server, connector begin to withstand high current load, which results in temperature up and voltage drop issues and begins to haunt connector factory engineer. Unlike the electronic components (LEDs, IC, etc.) in which the power usually is indicated in specifications, the connector needs to compute the power in order to carry out the temperature rise analysis. This paper will conduct the analysis of temperature rising for the high current connector with 30 amps loading. First, ABAQUS software will be applied to analyze the electrical resistance of circuit board and to carry out the design of circuit board with smaller electrical resistance. Then, the power of the connector can be obtained by the calculated electrical resistance through Joule's Law. Finally, the circuit board and the connector are transmitted into the ICEPAK software for temperature rising simulation. The temperature rising test in accordance with the EIA-364-70B specification is conducted and the test results are compared with simulation results. The result shows the difference of highest temperature rise between the FEA and experimental test is only 1.92%, and the simulated temperature distribution by FEA is similar to the experimental test results. The accuracy of the analysis and the experimental results are validated by the third party laboratory Underwriters Laboratories.
|
|---|
