The comparison of organic solvent and plasma treatment on the cleaning process of LEDs

• Main Authors: Wencheng Hsu, 徐文政
• Other Authors: Jihe Gong
• Format: Others
• Language: zh-TW
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/22099320387665181480

碩士 === 國立聯合大學 === LED光電製程產業專班 === 101 === Before the wire in the LED process will use plasma cleaning machine Plasma to remove the surface oxide layer and pollution generated by the PCB and Lead frame in the process aimed at strengthening Wire bond adhesion and increase the gold wire pull and ball thrustbut the use of plasma cleaning timeliness, gold wire adhesion will continue to fall and even loose welding, the potential adverse impacts on the reliability of the LED to increase over time. In this study, the organic solvent with high development potential as a clean PCB and Lead frame, by changing the storage time and different coating the PCB, respectively, using plasma and organic solvents to clean the surface conditions of the SEM observation, and measurement its the droplets angle and wire pull and ball thrust. Study found that the use of organic solvents to clean PCB, increase over time, the water droplets angle and gold thread tension variations of were stable, waiting time, increase LED production to avoid the process takes too long to be repeated cleaning, resulting in wafer surface damage, affect LED reliability.