| Summary: | 碩士 === 國立臺灣科技大學 === 機械工程系 === 100 === In the market of electronic components, whether it’s metal or plastic injection molding, both are developed into the trend of light, thin, short and miniature models, while the traditional hot sprue diameter is between 20 to 50mm . In this experiment, the thick film resistor layer applied to replace the traditional spiral heating coil on the hot sprue, narrowing the diameter of hot sprue up to 12mm, to replace a traditional hot nozzle of diameter of 20 to 50mm.
The focus of this study is on the analysis of paste sinter layer; the composition of the nozzle consists of five parts, followed the main body of stainless steel, insulation layer, the resistive layer, the conductive layer (electrode) and coating, this experiment is to analyze the resistor paste deployment , the microstructure after sintering and the electrical properties.
Using silver as the main conductive phase, first press resistor paste onto the stainless steel specimen, dry at 120 ℃ for 15 minutes. Second, sintered in default of temperature (700, 750℃), held in the peak temperature of the furnace for 5-10 minutes and then cooling to the room temperature. Finally, observe its micro-structure by scanning through scanning electron microscope(SEM). As for elemental analysis energy dispersive spectrometer(EDS) is used, with these two instruments the formation of the internal pathway can be fully understood. In addition, sheet resistivity, resistivity and the temperature coefficient of resistance (TCR) with different sintering temperature and the paste composition ratio change will also be shown in this experiment.
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