A Study on Mechanical Property for Various Crystal Structure and Orientation after Diffusion Bonding by Molecular Dynamics Simulation

碩士 === 國立臺灣科技大學 === 機械工程系 === 100 === This study analyzes mechanical properties and deformation behaviors of various crystal structures and orientations of copper/tungsten and copper/nickel nanowires by simple tension tests after diffusion bonding using molecular dynamics (MD) simulation. Additional...

Full description

Bibliographic Details
Main Authors: Chong-Wei Huang, 黃崇瑋
Other Authors: Yuan-ching Lin
Format: Others
Language:zh-TW
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/03361804436830872321

Similar Items