A Study on Mechanical Property for Various Crystal Structure and Orientation after Diffusion Bonding by Molecular Dynamics Simulation

• Main Authors: Chong-Wei Huang, 黃崇瑋
• Other Authors: Yuan-ching Lin
• Format: Others
• Language: zh-TW
• Published: 2012
• Online Access: http://ndltd.ncl.edu.tw/handle/03361804436830872321

碩士 === 國立臺灣科技大學 === 機械工程系 === 100 === This study analyzes mechanical properties and deformation behaviors of various crystal structures and orientations of copper/tungsten and copper/nickel nanowires by simple tension tests after diffusion bonding using molecular dynamics (MD) simulation. Additionally, the bonding effects of diffusion bonding upon two crystal structures (FCC/BCC) and orientations (effects of crystal face) are compared. Results show that the ultimate tensile failure modes of FCC and BCC crystal structures of the copper/tungsten nanowires are located at the interface of materials by the four crystal orientations diffusion bonding, and the crystal surfaces of Cu(110)/W(110) of nanowires reveal superior strength and ductility. After the diffusion bonding of the same crystal structures (FCC/FCC) and four dissimilar crystal orientations of copper/nickel nanowires, necking and breaking phenomena are appeared in the copper atoms region; the Cu(100)/Ni(100) nanowires have optimum strength and ductility. The same crystal structure and face by the diffusion bonding of dissimilar metal nanowires can achieve the excellent bonding strength and ductility.