Interfacial Reaction between Ni Substrate and Lead Free Solder for 3D IC Application
碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 100 === For 3D IC applications, solder volume reduction is a significant issue in the chip-to-chip micro bumping process. For the reason, solder joints can contain a large portion of the intermetallic compounds （IMCs）. Many new issues must occur due to the reduction...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/70911843549080757336 |