Photolithography glass passivation process improvement

• Main Authors: Hsing-Kai Wang, 王星凱
• Other Authors: Chung-Cheng Chang
• Format: Others
• Language: zh-TW
• Published: 2012
• Online Access: http://ndltd.ncl.edu.tw/handle/90041955442149126931

碩士 === 國立臺灣海洋大學 === 電機工程學系 === 100 === Abstract In this thesis glass passivation process(GPP) use to improve the device leakage current capacity. By photolithography and glass firing process to achieve it’s purpose. The subject matter of this research, TVS(Transient Voltage Suppressor) greater than 100 volts of plant components, the main wafer 4inch、die size is 80mil, the purpose of this research focus on lithography process, use design of experiment (DOE) system to define the best parameters of process and effectively enhance the process stability and yield of device. The main results of this study, the glass passivation process improvement to optimize the parameter settings in the experimental design, mass production trial production results, the glass under cut to improve by more than 50%.