A CMOS 4×4 Capacitive Ultrasonic Sensor Chip for 3D Photoacoustic Imaging
碩士 === 國立清華大學 === 奈米工程與微系統研究所 === 100 === This study proposed a 4 × 4 capacitive ultrasonic sensor chip produced by CMOS-MEMS process technology. By using the sensing circuit placed at the bottom of the sensor structure, the routing interconnect is reduced, so is the parasitic capacitance. It had a...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/89881582546201607572 |