Stress and Crack Aware Designs in 3D IC

Stress and Crack Aware Designs in 3D IC

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碩士 === 國立清華大學 === 資訊工程學系 === 100 === 因申請專利緣故，資料延後公開

Bibliographic Details
Main Authors:	Tsai, Nien-Yu, 蔡念豫
Other Authors:	Chang, Shih-Chieh
Format:	Others
Published:	2012
Online Access:	http://ndltd.ncl.edu.tw/handle/96520415220372771218

Internet

http://ndltd.ncl.edu.tw/handle/96520415220372771218

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