A Study of Fast Filling Through Silicon Via Interconnects Using Solder Reflow Technology

A Study of Fast Filling Through Silicon Via Interconnects Using Solder Reflow Technology

碩士 === 國立清華大學 === 動力機械工程學系 === 100 === 因申請專利緣故，資料延後公開

Bibliographic Details
Main Author: 林佳漢
Other Authors: 方維倫
Format: Others
Language:zh-TW
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/10398012608912908435
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spelling ndltd-TW-100NTHU53111112015-10-13T21:22:41Z http://ndltd.ncl.edu.tw/handle/10398012608912908435 A Study of Fast Filling Through Silicon Via Interconnects Using Solder Reflow Technology 應用錫膏回融快速填滿矽穿孔連接器技術之研究 林佳漢 碩士 國立清華大學 動力機械工程學系 100 因申請專利緣故，資料延後公開 方維倫 2012 學位論文 ; thesis 81 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立清華大學 === 動力機械工程學系 === 100 === 因申請專利緣故，資料延後公開
author2 方維倫
author_facet 方維倫
林佳漢
author 林佳漢
spellingShingle 林佳漢
A Study of Fast Filling Through Silicon Via Interconnects Using Solder Reflow Technology
author_sort 林佳漢
title A Study of Fast Filling Through Silicon Via Interconnects Using Solder Reflow Technology
title_short A Study of Fast Filling Through Silicon Via Interconnects Using Solder Reflow Technology
title_full A Study of Fast Filling Through Silicon Via Interconnects Using Solder Reflow Technology
title_fullStr A Study of Fast Filling Through Silicon Via Interconnects Using Solder Reflow Technology
title_full_unstemmed A Study of Fast Filling Through Silicon Via Interconnects Using Solder Reflow Technology
title_sort study of fast filling through silicon via interconnects using solder reflow technology
publishDate 2012
url http://ndltd.ncl.edu.tw/handle/10398012608912908435
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AT línjiāhàn studyoffastfillingthroughsiliconviainterconnectsusingsolderreflowtechnology
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