The Effects of Temperature and Substrate on Microstructure of Copper Films Prepared by Pulsed Electrodeposition
碩士 === 國立清華大學 === 材料科學工程學系 === 100 === Electrochemical deposition is commonly employed in the fabrication of copper interconnects owing to its low cost advantage and ease of mass production. To further down scaling the microelectronic device, more in-deep knowledge and process control concerning int...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/66290313455196540955 |