Repair Process Improvement—Surface Mount Technology Line
碩士 === 國立清華大學 === 工業工程與工程管理學系碩士在職專班 === 100 === The study proposed a process improvement analysis on fail module from SMT (Surface Mount Technology) production line. This paper examines the three major factors comprising the process improvement, repair cost analysis and repair age determination. The...
Main Author: | 吳蕙芬 |
---|---|
Other Authors: | 蘇哲平 |
Format: | Others |
Language: | zh-TW |
Published: |
2012
|
Online Access: | http://ndltd.ncl.edu.tw/handle/21100059705174055549 |
Similar Items
-
Improvement A Solder Ball of Surface Mount Technology Process
by: Chin-i Chang, et al.
Published: (2011) -
A Study of Process Improvement of Surface Mount Technology for PCB
by: Hsu, Ting-Chieh, et al.
Published: (2015) -
Optimization of Processing Parameters for LED with Surface Mount Technology
by: Kuan-ling Tseng, et al.
Published: (2010) -
Production Allocation for Printed Circuit Board Assembly - Surface Mount Technology Lines
by: Chuan-Wen Cheng, et al.
Published: (2006) -
Study to Improve the Powder Residue on the Depanelized Printed Circuit Board in Surface Mount Technology Process
by: Chung-Yuan Hsu, et al.
Published: (2016)