| Summary: | 碩士 === 國立彰化師範大學 === 機電工程學系 === 100 === In this study, CIGS was deposited on the flexible SUS430 stainless steel and Upilex-S 50S Polyimide substrate by magnetron sputtering. The simulations of residual stress was analyzed by using finite element method, and its result contrasted with XRD measure. Additionally, that studied the effect of external stress on CIGS. It is resulted that elastic modulus of Mo and CIGS was 133~172 GPa and 73.4~83.6 GPa. The coefficient of thermal expansion of Mo and CIGS was 5.3610-6 K-1 and 8.5710-6 K-1, and that Poisson's ratio was 0.3 and 0.27. The Mo and CIGS were better resistance against external stress when the Mo(RMo=66%) back contact was deposited on the flexible SUS430 stainless steel and Upilex-S 50S Polyimide substrate. After bending stresses from external, the CIGS surface roughness and the crystal structure become worse, for the crystal structure, the Mo back contact was more effect than CIGS.
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