| Summary: | 碩士 === 國立中央大學 === 管理學院高階主管企管碩士班 === 100 === IC substrate industry is technology-intensive, knowledge-intensive, capital-intensive, and high value-added. Following the successful experience of Taiwan PCB industry, a vertical supply chain of IC substrate has developed in Taiwan. Therefore, major IC brands worldwide all rely on the manufacturing and R&D capabilities of Taiwanese firms, making these Taiwanese firms their major OEM partners.
Although new competitors continuously enter into the IC substrate industry, its market still shows steady growth due to the widespread application of IC with multi-function, high I/O density and small form-factor on 3C products, including CPU, chipset, 3G mobile phone, RF module, network/communication, digital TV, TV box and so on.
“Case Study” is used in this thesis to analyse the case of how Company N, a major manufacturer of IC substrate in the domestic market, constructs a strategic plan for the future development, after considering the changing of technical environment as well as the competition it faces.
This research shows that IC substrate manufacturers should keep on promoting techniques so as to evolve with the semiconductor industry. Besides, product quality improvement and fast development for new products to meet the short lifecycle of electronic products are all the critical factors to success in this industry.
|
|---|
