Evaluation of Diffusion Barrier between Pure Tin and Tellurium
碩士 === 國立中央大學 === 化學工程與材料工程研究所 === 100 === To simplify the element of bismuth telluride thermoelectric materials, the experiments reported in this study used Te as the substrate to evaluate the capability of Ni as a diffusion barrier. Ni-P or Ni-P/Co-P was coated on Te by electroless plating and the...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/48688173089208741701 |