Applying Data Mining Techniques to the Overkill Analysis of Wafer Testing
碩士 === 國立交通大學 === 理學院應用科技學程 === 100 === Wafer probing is a critical process employed to measure the yield of wafer fabrication. The major object of wafer probing is to find the defect dice on the wafer. It inputs electrical current and signals through the probe needles which contact the pad of each...
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| Format: | Others |
| Language: | zh-TW |
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2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/70367623958346674422 |