Improvement on Using Pull-in Voltage to Detecting Residual Stress of Curled Micro Cantilever Beam

碩士 === 國立交通大學 === 機械工程學系 === 100 === Residual stress due to the fabrication process might cause the deformation of MEMS devices. Using pull-in voltage to determine residual stress is possible to directly detect residual stress on MEMS fabrication process. In previous studies using pull-in voltage to...

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Main Authors: Chen, He-Ling, 陳鶴齡
Other Authors: Hsu, Wens-Yang
Format: Others
Language:en_US
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/80136932101757179177
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spelling ndltd-TW-100NCTU54891402016-03-28T04:20:53Z http://ndltd.ncl.edu.tw/handle/80136932101757179177 Improvement on Using Pull-in Voltage to Detecting Residual Stress of Curled Micro Cantilever Beam 以吸附電壓量測微懸臂樑之殘留應力之改進 Chen, He-Ling 陳鶴齡 碩士 國立交通大學 機械工程學系 100 Residual stress due to the fabrication process might cause the deformation of MEMS devices. Using pull-in voltage to determine residual stress is possible to directly detect residual stress on MEMS fabrication process. In previous studies using pull-in voltage to detect residual stress, the tilting effect of cantilever beam was not been taken into consideration. This study proposed a modified deformation function, which considered both curl and tilt deformation caused by gradient stress and mean stress. And this proposed deformation function was used to evaluate the pull-in voltage of the cantilever beam. In test experiment, the cantilever is made of poly-silicon, with three different lengths, 256um, 300um and 330um. The tilt angle and radius of curvature can be determined by white light interferometer (WLI). By comparing the analytical result with measurement results on pull-in voltages, it is found that without considering tilting effect, the average mismatch between analytical solutions and experimental results on pull-in voltage is in a range of 6.02% to 15.20%. On the other hand, when tilting effect is considered, this mismatch is reduced to a range of -4.44% to 5.26% which verifies the improvement of the proposed analytical solution. Hsu, Wens-Yang 徐文祥 2012 學位論文 ; thesis 39 en_US
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language en_US
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description 碩士 === 國立交通大學 === 機械工程學系 === 100 === Residual stress due to the fabrication process might cause the deformation of MEMS devices. Using pull-in voltage to determine residual stress is possible to directly detect residual stress on MEMS fabrication process. In previous studies using pull-in voltage to detect residual stress, the tilting effect of cantilever beam was not been taken into consideration. This study proposed a modified deformation function, which considered both curl and tilt deformation caused by gradient stress and mean stress. And this proposed deformation function was used to evaluate the pull-in voltage of the cantilever beam. In test experiment, the cantilever is made of poly-silicon, with three different lengths, 256um, 300um and 330um. The tilt angle and radius of curvature can be determined by white light interferometer (WLI). By comparing the analytical result with measurement results on pull-in voltages, it is found that without considering tilting effect, the average mismatch between analytical solutions and experimental results on pull-in voltage is in a range of 6.02% to 15.20%. On the other hand, when tilting effect is considered, this mismatch is reduced to a range of -4.44% to 5.26% which verifies the improvement of the proposed analytical solution.
author2 Hsu, Wens-Yang
author_facet Hsu, Wens-Yang
Chen, He-Ling
陳鶴齡
author Chen, He-Ling
陳鶴齡
spellingShingle Chen, He-Ling
陳鶴齡
Improvement on Using Pull-in Voltage to Detecting Residual Stress of Curled Micro Cantilever Beam
author_sort Chen, He-Ling
title Improvement on Using Pull-in Voltage to Detecting Residual Stress of Curled Micro Cantilever Beam
title_short Improvement on Using Pull-in Voltage to Detecting Residual Stress of Curled Micro Cantilever Beam
title_full Improvement on Using Pull-in Voltage to Detecting Residual Stress of Curled Micro Cantilever Beam
title_fullStr Improvement on Using Pull-in Voltage to Detecting Residual Stress of Curled Micro Cantilever Beam
title_full_unstemmed Improvement on Using Pull-in Voltage to Detecting Residual Stress of Curled Micro Cantilever Beam
title_sort improvement on using pull-in voltage to detecting residual stress of curled micro cantilever beam
publishDate 2012
url http://ndltd.ncl.edu.tw/handle/80136932101757179177
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