The Study of LTPS-TFTs with CF4 plasma pre-treated poly-silicon and N2 plasma post-treated HfO2 Gate Dielectric Layer

碩士 === 國立交通大學 === 電子研究所 === 100 === In recent years, high performance low-temperature polycrystalline-silicon thin-film transistors (LTPS-TFTs) have been attracted much attention due to the increasing applications in active matrix display (AMLCDs). However, the scaling to Moore’s law are limited to...

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Main Authors: Huang, Bo-Wen, 黃柏文
Other Authors: Chang, Kow-Ming
Format: Others
Language:en_US
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/65163895817711614308
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spelling ndltd-TW-100NCTU54281762016-03-28T04:20:39Z http://ndltd.ncl.edu.tw/handle/65163895817711614308 The Study of LTPS-TFTs with CF4 plasma pre-treated poly-silicon and N2 plasma post-treated HfO2 Gate Dielectric Layer 利用四氟化碳電漿處理於多晶矽及氮電漿處理於二氧化鉿閘極介電層之低溫多晶矽薄膜電晶體之研究 Huang, Bo-Wen 黃柏文 碩士 國立交通大學 電子研究所 100 In recent years, high performance low-temperature polycrystalline-silicon thin-film transistors (LTPS-TFTs) have been attracted much attention due to the increasing applications in active matrix display (AMLCDs). However, the scaling to Moore’s law are limited to the lithography, the more minimum feature size as we need to pattern, the shorter wavelengths of light we must to achieve, so it is impossible to scale down forever. It is terrible that gate oxide is so thin (1.4 nm) which caused an intolerable gate leakage due to direct tunneling current. Therefore, high-k gate dielectric material has been extensively studied in recent year, which could effectively reduce leakage current and improve device performance. There are many high-k dielectric materials had been used before, hafnium oxide (HfO2) is considered one of the promising high-k gate material due to its high permittivity (25-30), wide energy bandgap and thermal stability with poly-Si. The HfO2 LTPS-TFTs were used as without treatment sample and combined with dual plasma treatment because of the combination of pre-deposition plasma fluorination and post-deposition plasma nitridation. We discussed not only the basic electrical characteristics but also reliability properties such as positive-bias stress instability (PBI), positive-bias temperature instability (PBTI), negative-bias stress instability (NBI) and hot carrier stress (HCS). No matter how the stress mechanism applies, the dual plasma treatment LTPS-TFTs exhibits a superior performance than without treatment. It might be that fluorine incorporation can improve the interface quality and nitrogen also can repair defects at bulk dielectric to decrease the leakage current. Chang, Kow-Ming 張國明 2012 學位論文 ; thesis 99 en_US
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language en_US
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sources NDLTD
description 碩士 === 國立交通大學 === 電子研究所 === 100 === In recent years, high performance low-temperature polycrystalline-silicon thin-film transistors (LTPS-TFTs) have been attracted much attention due to the increasing applications in active matrix display (AMLCDs). However, the scaling to Moore’s law are limited to the lithography, the more minimum feature size as we need to pattern, the shorter wavelengths of light we must to achieve, so it is impossible to scale down forever. It is terrible that gate oxide is so thin (1.4 nm) which caused an intolerable gate leakage due to direct tunneling current. Therefore, high-k gate dielectric material has been extensively studied in recent year, which could effectively reduce leakage current and improve device performance. There are many high-k dielectric materials had been used before, hafnium oxide (HfO2) is considered one of the promising high-k gate material due to its high permittivity (25-30), wide energy bandgap and thermal stability with poly-Si. The HfO2 LTPS-TFTs were used as without treatment sample and combined with dual plasma treatment because of the combination of pre-deposition plasma fluorination and post-deposition plasma nitridation. We discussed not only the basic electrical characteristics but also reliability properties such as positive-bias stress instability (PBI), positive-bias temperature instability (PBTI), negative-bias stress instability (NBI) and hot carrier stress (HCS). No matter how the stress mechanism applies, the dual plasma treatment LTPS-TFTs exhibits a superior performance than without treatment. It might be that fluorine incorporation can improve the interface quality and nitrogen also can repair defects at bulk dielectric to decrease the leakage current.
author2 Chang, Kow-Ming
author_facet Chang, Kow-Ming
Huang, Bo-Wen
黃柏文
author Huang, Bo-Wen
黃柏文
spellingShingle Huang, Bo-Wen
黃柏文
The Study of LTPS-TFTs with CF4 plasma pre-treated poly-silicon and N2 plasma post-treated HfO2 Gate Dielectric Layer
author_sort Huang, Bo-Wen
title The Study of LTPS-TFTs with CF4 plasma pre-treated poly-silicon and N2 plasma post-treated HfO2 Gate Dielectric Layer
title_short The Study of LTPS-TFTs with CF4 plasma pre-treated poly-silicon and N2 plasma post-treated HfO2 Gate Dielectric Layer
title_full The Study of LTPS-TFTs with CF4 plasma pre-treated poly-silicon and N2 plasma post-treated HfO2 Gate Dielectric Layer
title_fullStr The Study of LTPS-TFTs with CF4 plasma pre-treated poly-silicon and N2 plasma post-treated HfO2 Gate Dielectric Layer
title_full_unstemmed The Study of LTPS-TFTs with CF4 plasma pre-treated poly-silicon and N2 plasma post-treated HfO2 Gate Dielectric Layer
title_sort study of ltps-tfts with cf4 plasma pre-treated poly-silicon and n2 plasma post-treated hfo2 gate dielectric layer
publishDate 2012
url http://ndltd.ncl.edu.tw/handle/65163895817711614308
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