Three-Dimensional Integrated Circuit Key Technology: Metal to Polymer Hybrid Bonding
碩士 === 國立交通大學 === 電子研究所 === 100 === The main topics of this thesis include electrical characterization and reliability investigation of metal to polymer hybrid bonding in three-dimensional integrated circuit. Hybrid bonding is one of the most important technologies in 3D-ICs because of dielectric po...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/b8ejgu |