Power Integrity for TSV 3D Integration
碩士 === 國立交通大學 === 電子研究所 === 100 === In this thesis, a hierarchical power delivery system is proposed for the power integrity of through-silicon-via (TSV) 3D integrations using various noise reduction techniques. The proposed hierarchical power delivery system decouples the global power network and t...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/56664866806400415887 |